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| NEC's HIGH POWER SINGLE CONTROL UPG2010TB L-BAND SPDT SWITCH FEATURES * SUPPLY VOLTAGE: VDD = 2.7 to 3.0 V (2.8 V TYP.) * SWITCH CONTROL VOLTAGE: Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.) Vcont (L) = -0.2 to +0.2 V (0 V TYP.) * LOW INSERTION LOSS: LINS1 = 0.25 dB TYP. @ f = 0.5 to 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V LINS2 = 0.30 dB TYP. @ f = 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V LINS3 = 0.35 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value) * HIGH ISOLATION: ISL1 = = 28 dB TYP. @ f = 0.5 to 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V ISL2 = 25 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value) * POWER HANDLING: Pin (0.1 dB) = +33.0 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V * HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 x 1.25 x 0.9 mm) DESCRIPTION NEC's UPG2010TB is a single control GaAs MMIC L-band SPDT (Single Pole Double Throw) switch for mobile phone and L-band applications. This device can operate from 0.5 to 2.5 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin super minimold package, suitable for high-density surface mounting. APPLICATIONS * L-band digital cellular or cordless handsets * PCS, W-LAN, WLL and BluetoothTM * Short Range Wireless ORDERING INFORMATION Part Number PG2010TB-E3 Package 6-pin super minimold Marking G2Y Supplying Form * Embossed tape 8 mm wide * Pin 1, 2, 3 face the perforation side of the tape * Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2010TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. California Eastern Laboratories UPG2010TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 3 2 1 43 52 61 (Top View) 44 55 66 (Bottom View) 3 2 1 Pin No. 1 Pin Name OUTPUT1 GND OUTPUT2 VCont INPUT VDD G2Y 2 3 4 5 6 TRUTH TABLE Vcont1 Low High INPUT-OUTPUT1 ON OFF INPUT-OUTPUT2 OFF ON ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified) Parameter Supply Voltage Switch Control Voltage Input Power Power Dissipation Operating Ambient Temperature Storage Temperature Symbol VDD Vcont Pin PD TA Tstg Ratings 6.0 6.0 +36 150 Note -45 to +85 -55 to +150 Unit V V dBm mW C C Note Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB, TA = +85C RECOMMENDED OPERATING RANGE (TA = 25C, unless otherwise specified) Parameter Switch Voltage Switch Control Voltage (H) Switch Control Voltage (L) Symbol VDD Vcont (H) Vcont (L) MIN. 2.7 2.7 -0.2 TYP. 2.8 2.8 0 MAX. 3.0 3.0 0.2 Unit V V V UPG2010TB ELECTRICAL CHARACTERISTICS (TA = +25C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Isolation 1 Input Return Loss Output Return Loss 0.1 dB Gain Compression Input Power Note 2nd Harmonics 3rd Harmonics Supply Current Switch Control Current Symbol LINS1 LINS2 ISL1 RLin RLout Pin (0.1 dB) 2f0 3f0 IDD Icont Test Conditions f = 0.5 to 1.0 GHz f = 2.0 GHz f = 0.5 to 2.0 GHz f = 0.5 to 2.5 GHz f = 0.5 to 2.5 GHz f = 1.0 GHz f = 1.0 GHz, Pin = +30.5 dBm f = 1.0 GHz, Pin = +30.5 dBm MIN. - - 24 15 15 +31.5 65 65 - - TYP. 0.25 0.30 28 20 20 +33.0 75 75 50 4 MAX. 0.45 0.50 - - - - - - 100 20 Unit dB dB dB dB dB dBm dBc dBc A A Note Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 51 pF, unless otherwise specified) Parameter Insertion Loss 3 Isolation 2 Switch Control Speed Symbol LINS3 ISL2 tSW Test Conditions f = 2.5 GHz f = 2.5 GHz MIN. - - - TYP. 0.35 25 1 MAX. - - - Unit dB dB s Caution It is necessary to use DC blocking capacitors with the device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. UPG2010TB EVALUATION CIRCUIT (VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF) OUTPUT1 OUTPUT2 56 pF 56 pF 1 2 3 6 5 4 1 000 pF 56 pF 1 000 pF VDD INPUT Vcont The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4-277 UPG2010TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD VDD 6Pin SMM SPDT SW VC 1 OUTPUT1 OUT 1 C 5 C2 C 1 C1 G2Y INPUT C1 IN C3 C1 C C 4 2 C2 OUT 2 OUTPUT2 VC 2 Vcont USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 56 pF 1 000 pF UPG2010TB TYPICAL CHARACTERISTICS (TA = 25C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) INPUT-OUTPUT1 INSERTION LOSS vs. FREQUENCY 0.4 0.3 Insertion Loss LINS (dB) Insertion Loss LINS (dB) 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 -0.6 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 INPUT-OUTPUT2 INSERTION LOSS vs. FREQUENCY -0.6 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) INPUT-OUTPUT1 ISOLATION vs. FREQUENCY 50 40 30 Isolation ISL (dB) 20 10 0 -10 -20 -30 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Isolation ISL (dB) 50 40 30 20 10 0 -10 -20 -30 -40 INPUT-OUTPUT2 ISOLATION vs. FREQUENCY -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) INPUT-OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY 50 40 30 20 10 0 -10 -20 -30 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Input Return Loss RLin (dB) Input Return Loss RLin (dB) INPUT-OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 50 40 30 20 10 0 -10 -20 -30 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Remark The graphs indicate nominal characteristics. UPG2010TB INPUT-OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY 50 Output Return Loss RLout (dB) Frequency f (GHz) Output Return Loss RLout (dB) 40 30 20 10 0 -10 -20 -30 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 INPUT-OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 50 40 30 20 10 0 -10 -20 -30 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) 2nd Harmonics 2f0, 3rd Harmonics 3f0 (dBc) OUTPUT POWER vs. INPUT POWER +45 f = 1.0 GHz +40 Output Power Pout (dBm) +35 +30 +25 +20 +15 +10 +5 +10 +15 +20 +25 +30 +35 +40 2ND HARMONICS, 3RD HARMONICS vs. INPUT POWER -50 f = 1.0 GHz -55 -60 -65 -70 -75 2f0 -80 -85 -90 +10 +15 +20 +25 3f0 +30 +35 +40 Input Power Pin (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. UPG2010TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.10.1 1.250.1 2.00.2 1.3 0.65 0.65 0.1 MIN. 0.90.1 0.7 0 to 0.1 0.15+0.1 -0.05 0.2+0.1 -0.05 UPG2010TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (package surface temperature) Time at temperature of 200C or higher Preheating time at 120 to 150C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 215C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 120C or below : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below Condition Symbol IR260 VPS VP215 Wave Soldering WS260 Partial Heating HS350 Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 02/19/2004 A Business Partner of NEC Compound Semiconductor Devices, Ltd. |
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